1. 2. 3. material content data sheet sales product name ipa60r520e6 issued 29. august 2013 ma# MA000837402 package pg-to220-3-111 weight* 2240.01 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.425 0.15 0.15 1529 1529 leadframe non noble metal iron 7439-89-6 1.120 0.05 500 inorganic material phosphorus 7723-14-0 0.336 0.02 150 non noble metal copper 7440-50-8 1118.332 49.93 50.00 499253 499903 wire non noble metal aluminium 7429-90-5 0.661 0.03 0.03 295 295 encapsulation organic material carbon black 1333-86-4 2.212 0.10 988 plastics epoxy resin - 207.943 9.28 92831 inorganic material silicondioxide 60676-86-0 895.924 40.00 49.38 399964 493783 leadfinish non noble metal tin 7440-31-5 7.942 0.35 0.35 3545 3545 plating non noble metal nickel 7440-02-0 0.305 0.01 136 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 136 solder non noble metal antimony 7440-36-0 0.181 0.01 81 noble metal silver 7440-22-4 0.453 0.02 202 non noble metal tin 7440-31-5 1.178 0.05 0.08 526 809 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
